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Nga Panui Ahumahi: Ka whakarewahia e Samsung te ratonga kohinga maramara 3D HBM i te tau 2024

Nga Panui Ahumahi: Ka whakarewahia e Samsung te ratonga kohinga maramara 3D HBM i te tau 2024

SAN JOSE -- Ka whakarewahia e Samsung Electronics Co. nga ratonga whakakai toru-ahu (3D) mo te mahara whanui-nui (HBM) i roto i te tau, he hangarau e tika ana kia whakauruhia mo te tauira whakatipuranga tuaono o te maramara mohio hangahanga HBM4 i te tau 2025, e ai ki te kamupene me nga puna ahumahi.
I te Hune 20, i huraina e te kaihanga maramara nui rawa atu o te ao tana hangarau whakakakahu maramara hou me nga mahere huarahi ratonga i te Huihuinga Whakarewa Samsung 2024 i tu ki San Jose, California.

Koinei te wa tuatahi ki te tuku a Samsung i te hangarau kapi 3D mo nga maramara HBM i roto i tetahi huihuinga a te iwi.I tenei wa, ko nga maramara HBM te nuinga o te waa ki te hangarau 2.5D.
I puta mai i te rua wiki i muri mai i te whakatuwheratanga o te kaiwhakarewa takirua me te Kaiwhakahaere Matua a Nvidia a Jensen Huang i te hoahoanga whakatipuranga hou o tana papaahi AI Rubin i te wa e korero ana i Taiwana.
Ko te HBM4 pea ka whakauruhia ki roto i te tauira Rubin GPU hou a Nvidia e kiia ana ka pa ki te maakete i te tau 2026.

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HUNGA POUNGA

Ko te hangarau hou a Samsung e whakaatu ana i nga maramara HBM kua tapae poutū ki runga ake o te GPU hei whakatere ake i te ako raraunga me te tukatuka whakatau, he hangarau e kiia ana he kaihuri keemu i te maakete maramara AI e tipu haere ana.
I tenei wa, ko nga maramara HBM e hono whakapae ana me te GPU i runga i te kaitahuri silicon i raro i te hangarau whakangao 2.5D.

Ma te whakataurite, karekau e hiahiatia e te kohinga 3D he kaiwawao hiko, he taputapu angiangi ranei e noho ana i waenganui i nga maramara kia taea ai e ratou te whakawhitiwhiti korero me te mahi tahi.Ka tapaina e Samsung tana hangarau putunga hou ko SAINT-D, he poto mo Samsung Advanced Interconnection Technology-D.

RATONGA TURNKKEY

Ko te kamupene Korea ki te Tonga e mohio ana ki te tuku i te kohinga 3D HBM i runga i te kaupapa turnkey.
Ki te mahi pera, ka hono poutū tana roopu whakahiato i nga maramara HBM i hangaia i tana wahanga pakihi mahara me nga GPU i whakaemihia mo nga kamupene pakiwaitara e tana waahanga hangahanga.

"Ka whakaitihia e te kohinga 3D te kai hiko me te whakaroa i te tukatuka, te whakapai ake i te kounga o nga tohu hiko o nga maramara semiconductor," e kii ana tetahi rangatira Samsung Electronics.I te tau 2027, kei te whakaaro a Samsung ki te whakauru i nga hangarau whakauru rereke katoa-i-kotahi e whakauru ana i nga huānga whatu e tino whakanui ana i te tere tuku raraunga o nga semiconductors ki roto i te kete kotahi o nga kaiwhakatere AI.

I runga i te piki haere o te hiahia mo nga maramara iti-kaha, te mahi nui, ka whakaarohia e HBM te 30% o te maakete DRAM i te 2025 mai i te 21% i te 2024, e ai ki a TrendForce, he kamupene rangahau Taiwanese.

Ko te MGI Research e matapae ana ko te maakete whakangao paanui, tae atu ki te kete 3D, ka piki ki te $80 piriona i te tau 2032, ka whakaritea ki te $34.5 piriona i te tau 2023.


Wā tuku: Hune-10-2024